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A-70567-0257 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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A-70567-0257 Datasheet
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A-70567-0257 и другие |
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Компонент | Описание | Производитель | PDF |
507-145-NF51-2EK |
Micro-D Backshells EMI Split Backshell, Round Cable Entry 507-145 |
Glenair, Inc. |
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1N3494 |
Silicon Power Rectifier |
Microsemi Corporation |
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A-70567-0281 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating |
Molex Electronics Ltd. |
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0026481075 |
3.96mm (.156") Pitch KK^ Header, Breakaway, Vertical, Square Pin, with Friction Lock, 7 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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AS29F200B-55SI |
5V 256K x 8/128K x 8 CMOS FLASH EEPROM |
Alliance Semiconductor Corporation |
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