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Поиск Datasheets |
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| 73644-2110 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 72 Circuits |
Molex Electronics Ltd. |
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73644-2110 Datasheet
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Постоянная ссылка на эту страницу |
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73644-2110 и другие |
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| Компонент | Описание | Производитель | PDF |
| 370AR023C10 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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| 370AR023G16 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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| 73644-2017 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits |
Molex Electronics Ltd. |
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| 73644-2116 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits |
Molex Electronics Ltd. |
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| 501571-4007 |
1.00mm (.039") Pitch Pico-Clasp Wire-to-Board PCB Header, Dual Row, Right Angle, 40 Circuits, Lead-free |
Molex Electronics Ltd. |
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