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Поиск Datasheets |
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| 73644-2017 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits |
Molex Electronics Ltd. |
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73644-2017 Datasheet
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Постоянная ссылка на эту страницу |
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73644-2017 и другие |
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| Компонент | Описание | Производитель | PDF |
| 73644-2116 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits |
Molex Electronics Ltd. |
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| 501571-4007 |
1.00mm (.039") Pitch Pico-Clasp Wire-to-Board PCB Header, Dual Row, Right Angle, 40 Circuits, Lead-free |
Molex Electronics Ltd. |
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| 0015910507-ND |
2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs |
Molex Electronics Ltd. |
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| 73644-2018 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits |
Molex Electronics Ltd. |
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| 370AR023G18 |
Submersible Split Shell Cable Sealing Backshell |
Glenair, Inc. |
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