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Поиск Datasheets |
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| A-70567-0350 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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A-70567-0350 Datasheet
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Постоянная ссылка на эту страницу |
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A-70567-0350 и другие |
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| Компонент | Описание | Производитель | PDF |
| A-70567-0346 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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| 507-145E31FB |
EMI/RFI Split Shell Banding Backshell |
Glenair, Inc. |
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| AG-240128I |
SPECIFICATIONS FOR LCD MODULE |
ZETTLER Electronics |
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| 1N3605 |
silicon diode |
List of Unclassifed Manufacturers |
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| 0026604170 |
3.96mm (.156") Pitch KK Solid Header, Vertical, Friction Lock, 17 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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