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Поиск Datasheets |
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507-145M37FB |
EMI/RFI Split Shell Banding Backshell |
Glenair, Inc. |
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507-145M37FB Datasheet
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Постоянная ссылка на эту страницу |
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507-145M37FB и другие |
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Компонент | Описание | Производитель | PDF |
1N3644 |
Microminiature package. |
New Jersey Semi-Conductor Products, Inc. |
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1N3643 |
Microminiature package. |
New Jersey Semi-Conductor Products, Inc. |
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A-70568-0013 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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507-145M25FB |
EMI/RFI Split Shell Banding Backshell |
Glenair, Inc. |
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A-70567-0394 |
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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