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CY7C1370CV25-167AC |
512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
Cypress Semiconductor |
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CY7C1370CV25-167AC Datasheet
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CY7C1370CV25-167AC и другие |
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Компонент | Описание | Производитель | PDF |
0737711190 |
2.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise Vertical,SMC, Press-Fit, Guide Pin Option, 144 Circuits |
Molex Electronics Ltd. |
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0736565000 |
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Power Module, Vertical, SMC |
Molex Electronics Ltd. |
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2-1445084-2 |
VERTICAL THRU HOLE HEADER ASSY, 0.38 MIC GOLD CONTACTS W/PCB PLZN FEATURE, SGL ROW, MICRO MATE-N-LOK |
Tyco Electronics |
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AX2000-BG896 |
Axcelerator Family FPGAs |
Actel Corporation |
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07211413 |
tyco electronics contents |
Tyco Electronics |
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